基于玻璃通孔的Ka波段宽带滤波封装天线

方针; 张继华; 高莉彬; 陈宏伟; 李文磊; 梁天鹏; 蔡旭东; 蔡星周; 贾惟聪; 郭欢; 李勇

doi:10.1631/FITEE.2200573

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基于玻璃通孔的Ka波段宽带滤波封装天线

常规文章 | Updated：2023-07-03

- 基于玻璃通孔的Ka波段宽带滤波封装天线
- Ka-band broadband filtering packaging antenna based on through-glass vias (TGVs)
- 信息与电子工程前沿(英文版) 2023年24卷第6期页码：916-926
- Affiliations：
  
  1.School of Integrated Circuit Science and Engineering, University of Electronic Science and Technology of China,Chengdu 610054, China
  2.State Key Laboratory of Electronic Thin Films and Integrated Devices, University of Electronic Science and Technology of China,Chengdu 610054, China
  3.Chengdu Micro-Technology Co., Ltd.,Chengdu 611731, China
- Author bio：
  
  †E-mail: zhenfang@std.uestc.edu.cn
  ‡ Corresponding author
- Funds：
  
  the Fundamental Research Funds for the Central Universities, China(ZYGX2019Z003)
- DOI：10.1631/FITEE.2200573
  中图分类号： TN828.6
- 收稿：2022-11-17，
  
  修回：2023-01-06，
  
  纸质出版：2023-06-0
- Accepted：
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方针, 张继华, 高莉彬, 等. 基于玻璃通孔的Ka波段宽带滤波封装天线[J]. 信息与电子工程前沿(英文版), 2023,24(6):916-926.

Zhen FANG, Jihua ZHANG, Libin GAO, et al. Ka-band broadband filtering packaging antenna based on through-glass vias (TGVs)[J]. Frontiers of Information Technology & Electronic Engineering, 2023, 24(6): 916-926.
方针, 张继华, 高莉彬, 等. 基于玻璃通孔的Ka波段宽带滤波封装天线[J]. 信息与电子工程前沿(英文版), 2023,24(6):916-926. DOI： 10.1631/FITEE.2200573.

Zhen FANG, Jihua ZHANG, Libin GAO, et al. Ka-band broadband filtering packaging antenna based on through-glass vias (TGVs)[J]. Frontiers of Information Technology & Electronic Engineering, 2023, 24(6): 916-926. DOI： 10.1631/FITEE.2200573.

摘要

以玻璃封装材料和玻璃通孔技术为基础，提出一种新的Ka波段（33 GHz）滤波封装天线（FPA），该天线具有宽频带和高滤波响应特点。与传统封装材料（印刷电路板、低温共烧陶瓷、硅等）相比，玻璃通孔更适合小型化技术（毫米波三维封装器件），具有优越的微波性能。玻璃基板通过键合技术可实现三维高密度互联，其热膨胀系数与硅相当。此外，玻璃基板的堆叠实现了高密度互连，并与微电子技术兼容。该天线辐射贴片由贴片天线和反射系数几乎互补的带通滤波器（BPF）组成。BPF单元有3对

/4槽（缺陷微带结构）和两对

/2 U形缝隙（缺陷地结构）。该天线实现了大带宽和高辐射效率，这可能与玻璃基板的叠加和玻璃通孔馈电有关。此外，引入4个辐射零值可有效提高阻带内的抑制水平。为验证所提设计性能，对33 GHz宽带滤波天线进行优化、调试和测量。天线的工作带宽为29.4‒36.4 GHz（|

−10 dB），阻抗匹配带宽高达21.2%，阻带抑制水平大于16.5 dB。该天线实际增益为~6.5 dBi，辐射效率为~89%。

Abstract

This work presents a novel design of Ka-band (33 GHz) filtering packaging antenna (FPA) that features broadband and great filtering response

and is based on glass packaging material and through-glass via (TGV) technologies. Compared to traditional packaging materials (printed circuit board

low temperature co-fired ceramic

etc.)

TGVs are more suitable for miniaturization (millimeter-wave three-dimensional (3D) packaging devices) and have superior microwave performance. Glass substrate can realize 3D high-density interconnection through bonding technology

while the coefficient of thermal expansion (CTE) matches that of silicon. Furthermore

the stacking of glass substrate enables high-density interconnections and is compatible with micro-electro-mechanical system technology. The proposed antenna radiation patch is composed of a patch antenna and a bandpass filter (BPF) whose reflection coefficients are almost complementary. The BPF unit has three pairs of

/4 slots (defect microstrip structure

DMS) and two

/2 U-shaped slots (defect ground structure

DGS). The proposed antenna achieves large bandwidth and high radiation efficiency

which may be related to the stacking of glass substrate and TGV feed. In addition

the introduction of four radiation nulls can effectively improve the suppression level in the stopband. To demonstrate the performance of the proposed design

a 33-GHz broadband filtering antenna is optimized

debugged

and measured. The antenna could achieve |

-10 dB in 29.4‒36.4 GHz

and yield an impedance matching bandwidth up to 21.2%

with the stopband suppression level at higher than 16.5 dB. The measurement results of the proposed antenna are a realized gain of ~6.5 dBi and radiation efficiency of ~89%.

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