Void defect detection in ball grid array X-ray images using a new blob filter

Shao-hu PENG; Hyun Do NAM

doi:10.1631/jzus.C1200065

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Void defect detection in ball grid array X-ray images using a new blob filter

计算机与自动化 | Updated：2022-12-09

- Void defect detection in ball grid array X-ray images using a new blob filter
- Void defect detection in ball grid array X-ray images using a new blob filter
- 信息与电子工程前沿（英文） 2012年13卷第11期页码：840-849
- Affiliations：
  
  Department of Electronics and Electrical Engineering, Dankook University, Yongin 448-701, Korea
- Author bio：
  
  Hyun Do NAM, E-mail:hdnam@dankook.ac.kr
- Funds：
  
  Project supported by the Dankook University 2010 Funding for Research Institute of Information and Communication Convergence Technology (RICT), Korea
- DOI：10.1631/jzus.C1200065
  中图分类号： TP391;TN45
- 收稿：2012-03-15，
  
  修回：2012-;9-11，
  
  纸质出版：2012-11
- Accepted：
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Void defect detection in ball grid array X-ray images using a new blob filter[J]. 信息与电子工程前沿（英文）, 2012,13(11):840-849.

Shao-hu PENG, Hyun Do NAM. Void defect detection in ball grid array X-ray images using a new blob filter[J]. Frontiers of Information Technology & Electronic Engineering, 2012, 13(11): 840-849.
Void defect detection in ball grid array X-ray images using a new blob filter[J]. 信息与电子工程前沿（英文）, 2012,13(11):840-849. DOI： 10.1631/jzus.C1200065.

Shao-hu PENG, Hyun Do NAM. Void defect detection in ball grid array X-ray images using a new blob filter[J]. Frontiers of Information Technology & Electronic Engineering, 2012, 13(11): 840-849. DOI： 10.1631/jzus.C1200065.

摘要

Abstract

Ball grid arrays (BGAs) have been used in the production of electronic devices/assemblies because of their advantages of small size

high I/O port density

etc. However

BGA voids can degrade the performance of the board and cause failure. In this paper

a novel blob filter is proposed to automatically detect BGA voids presented in X-ray images. The proposed blob filter uses the local image gradient magnitude and thus is not influenced by image brightness

void position

or component interference. Different sized average box filters are employed to analyze the image in multi-scale

and as a result

the proposed blob filter is robust to void size. Experimental results show that the proposed method obtains void detection accuracy of up to 93.47% while maintaining a low false ratio. It outperforms another recent algorithm based on edge detection by 40.69% with respect to the average detection accuracy

and by 16.91% with respect to the average false ratio.

关键词

Keywords

references

H. Bay , , , A. Ess , , , T. Tuytelaars , , , L.V. Gool . . Speeded-up robust features (SURF) . . Comput. Vis. Image Understand. , , 2008 . . 110 ( ( 3 ): ): 346 - - 359 . . DOI: 10.1016/j.cviu.2007.09.014 http://doi.org/10.1016/j.cviu.2007.09.014 . .

J. Canny . . A computational approach to edge detection . . IEEE Trans. Pattern Anal. Mach. Intell. , , 1986 . . 8 ( ( 6 ): ): 679 - - 698 . . DOI: 10.1109/TPAMI.1986.4767851 http://doi.org/10.1109/TPAMI.1986.4767851 . .

W.C. Lin . . The Void-Free Reflow Soldering of BGA with Vacuum . . 8th Int. Conf. on Electronic Packaging Technology , , 2007 . . p.1 - - 5 . . DOI: 10.1109/ICEPT.2007.4441462 http://doi.org/10.1109/ICEPT.2007.4441462 . .

Y.M. Liu , , , L.B. Ye , , , P.Y. Zheng , , , X.R. Shi , , , B. Hu , , , J. Liang . . Multiscale classification and its application to process monitoring . . J. Zhejiang Univ.-Sci. C (Comput. & Electron.) , , 2010 . . 11 ( ( 6 ): ): 425 - - 434 . . DOI: 10.1631/jzus.C0910430 http://doi.org/10.1631/jzus.C0910430 . .

R. Maini , , , H. Aggarwal . . Study and comparison of various image edge detection techniques . . Int. J. Image Process. , , 2009 . . 3 ( ( 1 ): ): 1 - - 11 . . . .

N. Otsu . . A threshold selection method from gray-level histogram . . IEEE Trans. Syst. Man Cybern. , , 1979 . . 9 ( ( 1 ): ): 62 - - 66 . . DOI: 10.1109/TSMC.1979.4310076 http://doi.org/10.1109/TSMC.1979.4310076 . .

S.H. Peng , , , K. Muzzammil , , , D.H. Kim . . Robust Feature Detection Based on Local Variation for Image Retrieval . . 17th IEEE Int. Conf. on Image Processing , , 2010a . . p.1033 - - 1036 . . DOI: 10.1109/ICIP.2010.5652973 http://doi.org/10.1109/ICIP.2010.5652973 . .

S.H. Peng , , , D.H. Kim , , , S.L. Lee , , , M.K. Lim . . Texture feature extraction based on a uniformity estimation method for local brightness and structure in chest CT images . . Comput. Biol. Med. , , 2010b . . 40 ( ( 11-12 ): ): 931 - - 942 . . DOI: 10.1016/j.compbiomed.2010.10.005 http://doi.org/10.1016/j.compbiomed.2010.10.005 . .

S.M. Rooks , , , B. Benhabib , , , K.C. Smith . . Development of an inspection process for ball-grid-array technology using scanned-beam X-ray laminography . . IEEE Trans. Comp. Pack. Manuf. Technol. Part A , , 1995 . . 18 ( ( 4 ): ): 851 - - 861 . . DOI: 10.1109/95.477473 http://doi.org/10.1109/95.477473 . .

A.F. Said , , , B.L. Bennett , , , L.J. Karam , , , J. Pettinato . . Robust Automatic Void Detection in Solder Balls . . IEEE Int. Conf. on Acoustics Speech and Signal Processing , , 2010 . . p.1650 - - 1653 . . DOI: 10.1109/ICASSP.2010.5495524 http://doi.org/10.1109/ICASSP.2010.5495524 . .

A. Sa-nguannam , , , J. Srinonchat . . Analysis Ball Grid Array Defects by Using New Image Technique . . 9th Int. Conf. on Signal Processing , , 2008 . . p.785 - - 788 . . DOI: 10.1109/ICOSP.2008.4697247 http://doi.org/10.1109/ICOSP.2008.4697247 . .

V. Sankaran , , , A.R. Kalukin , , , R.P. Kraft . . Improvements to X-ray laminography for automated inspection of solder joints . . IEEE Trans. Comp. Pack. Manuf. Technol. Part C , , 1998 . . 21 ( ( 2 ): ): 148 - - 154 . . DOI: 10.1109/3476.681394 http://doi.org/10.1109/3476.681394 . .

M. Seul , , , L. O'Gorman , , , M.J. Sammon . . Practical Algorithms for Image Analysis: Descriptions, Examples, and Code , , Cambridge University Press , , : : UK 2008 . . .

T. Sumimoto , , , T. Maruyama , , , Y. Azuma , , , S. Goto , , , M. Mondo , , , N. Furukawa , , , S. Okada . . Detection of Defects at BGA Solder Joints by Using X-Ray Imaging . . IEEE Int. Conf. on Industrial Technology , , 2002 . . p.238 - - 241 . . DOI: 10.1109/ICIT.2002.1189898 http://doi.org/10.1109/ICIT.2002.1189898 . .

A. Teramoto , , , T. Murakoshi , , , M. Tsuzaka , , , H. Fujita . . Automated solder inspection technique for BGA-mounted substrates by means of oblique computed tomography . . IEEE Trans. Electr. Pack. Manuf. , , 2007 . . 30 ( ( 4 ): ): 285 - - 292 . . DOI: 10.1109/TEPM.2007.907574 http://doi.org/10.1109/TEPM.2007.907574 . .

P. Viola , , , M. Jones . . Rapid Object Detection Using a Boost Cascade of Simple Features . . Int. Conf. on Computer Vision and Pattern Recognition , , 2001 . . 1 511 - - 518 . . DOI: 10.1109/CVPR.2001.990517 http://doi.org/10.1109/CVPR.2001.990517 . .

N.J. Xia , , , Q.X. Cao , , , Z. Fu , , , J. Lee . . A Machine Vision System of Ball Grid Array Inspection on RT-Linux OS . . Int. Conf. on the Business of Electronic Product Reliability and Liability , , 2004 . . p.81 - - 85 . . DOI: 10.1109/BEPRL.2004.1308154 http://doi.org/10.1109/BEPRL.2004.1308154 . .

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