Electrical characterization of integrated passive devices using thin film technology for 3D integration

Xin SUN; Yun-hui ZHU; Zhen-hua LIU; Qing-hu CUI; Sheng-lin MA; Jing CHEN; Min MIAO; Yu-feng JIN

doi:10.1631/jzus.C12MNT01

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Electrical characterization of integrated passive devices using thin film technology for 3D integration

中国微纳技术学会专题，CSMNT2012 | Updated：2022-12-09

- Electrical characterization of integrated passive devices using thin film technology for 3D integration
- Electrical characterization of integrated passive devices using thin film technology for 3D integration
- 信息与电子工程前沿（英文） 2013年14卷第4期页码：235-243
- Affiliations：
  
  1.National Key Laboratory of Science and Technology on Micro/Nano Fabrication, Peking University, Beijing 100871, China
  2.Department of Mechanical and Electrical Engineering, Xiamen University, Xiamen 361005, China
  3.Information Microsystem Institute, Beijing Information Science and Technology University, Beijing 100085, China
- Author bio：
  
  [ "SUN Xin, sunxin@ime.pku.edu.cn" ]
  Yu-feng JIN, yfjin@pku.edu.cn
- Funds：
  
  Project (No. 2009ZX02038) supported by the National Science and Technology Major Project of China
- DOI：10.1631/jzus.C12MNT01
  中图分类号： TN405
- 收稿：2012-10-18，
  
  修回：2013-;3-15，
  
  纸质出版：2013-04
- Accepted：
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Electrical characterization of integrated passive devices using thin film technology for 3D integration[J]. 信息与电子工程前沿（英文）, 2013,14(4):235-243.

Xin SUN, Yun-hui ZHU, Zhen-hua LIU, et al. Electrical characterization of integrated passive devices using thin film technology for 3D integration[J]. Frontiers of Information Technology & Electronic Engineering, 2013, 14(4): 235-243.
Electrical characterization of integrated passive devices using thin film technology for 3D integration[J]. 信息与电子工程前沿（英文）, 2013,14(4):235-243. DOI： 10.1631/jzus.C12MNT01.

Xin SUN, Yun-hui ZHU, Zhen-hua LIU, et al. Electrical characterization of integrated passive devices using thin film technology for 3D integration[J]. Frontiers of Information Technology & Electronic Engineering, 2013, 14(4): 235-243. DOI： 10.1631/jzus.C12MNT01.

摘要

Abstract

With the development of 3D integration technology

microsystems with vertical interconnects are attracting attention from researchers and industry applications. Basic elements of integrated passive devices (IPDs)

including inductors

capacitors

and resistors

could dramatically save the footprint of the system

optimize the form factor

and improve the performance of radio frequency (RF) systems. In this paper

IPDs using thin film built-up technology are introduced

and the design and characterization of coplanar waveguides (CPWs)

inductors

and capacitors are presented.

关键词

Keywords

references

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