基于LTCC技术集成曲折线天线的封装天线系统

Gang DONG; Wei XIONG; Zhao-yao WU; Yin-tang YANG

doi:10.1631/FITEE.1500167

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基于LTCC技术集成曲折线天线的封装天线系统

常规文章 | Updated：2022-05-19

- 基于LTCC技术集成曲折线天线的封装天线系统
- Antenna-in-package system integrated with meander line antenna based on LTCC technology
- 信息与电子工程前沿（英文） 2016年17卷第1期页码：67-73
- Affiliations：
  
  School of Microelectronics, Xidian University, Xi’an 710071, China
- Author bio：
  
  E-mail:gdong@mail.xidian.edu.cn
- Funds：
  
  Project supported by the National Natural Science Foundation of China (Nos. 61574106 and 61334003), the National Defense Pre-research Foundation of China (No. 9140A2306 0115DZ01062), and the Key Science and Technology Special Project of Shaanxi Province, China (No. 2015KTCQ01-5)
- DOI：10.1631/FITEE.1500167
  中图分类号： TN82
- 收稿：2015-05-20，
  
  录用：2015-7-9，
  
  纸质出版：2016-01
- Accepted：
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基于LTCC技术集成曲折线天线的封装天线系统[J]. 信息与电子工程前沿（英文）, 2016,17(1):67-73.

Gang DONG, Wei XIONG, Zhao-yao WU, et al. Antenna-in-package system integrated with meander line antenna based on LTCC technology[J]. Frontiers of Information Technology & Electronic Engineering, 2016, 17(1): 67-73.
基于LTCC技术集成曲折线天线的封装天线系统[J]. 信息与电子工程前沿（英文）, 2016,17(1):67-73. DOI： 10.1631/FITEE.1500167.

Gang DONG, Wei XIONG, Zhao-yao WU, et al. Antenna-in-package system integrated with meander line antenna based on LTCC technology[J]. Frontiers of Information Technology & Electronic Engineering, 2016, 17(1): 67-73. DOI： 10.1631/FITEE.1500167.

摘要

目的

基于LTCC工艺，设计工作于2.4 GHz频段范围且满足性能指标要求的集成封装天线，同时设计封装腔体结构实现电路芯片的集成。

创新点

设计了一种曲折线天线结构用以实现系统的小型化。在封装层腔体内引入一种叠层多芯片组件结构，提高了整体集成度。通过添加通孔及馈线结构减少天线与封装层内部芯片间的电磁耦合。

方法

首先，基于LTCC的材料特性及设计的性能需要，设计一种曲折线形天线，并对其原理进行分析，对其回波损耗特性进行仿真（图3）。然后，针对封装天线集成电路芯片的需要，提出一种LTCC材料的多芯片组件结构（图8），同时在封装层内加入一定数量的金属通孔（图9），以减少天线与芯片间的电磁耦合。最后，将上述设计的天线与封装层结构整合在一起，并进行实际制作（图12），通过测试得到制作的封装天线系统的方向特性图（图13）和回波损耗特性曲线（图14）。

结论

针对2.4 GHz频段的应用需要，提出了一种小型化高集成度的封装天线结构。该结构满足实际应用所需的性能指标，且能方便地通过LTCC工艺实现。

Abstract

We present an antenna-in-package system integrated with a meander line antenna based on low temperature co-fired ceramic (LTCC) technology. The proposed system employs a meander line patch antenna

a packaging layer

and a laminated multi-chip module (MCM) for integration of integrated circuit (IC) bare chips. A microstrip feed line is used to reduce the interaction between patch and package. To decrease electromagnetic coupling

a via hole structure is designed and analyzed. The meander line antenna achieved a bandwidth of 220 MHz with the center frequency at 2.4 GHz

a maximum gain of 2.2 dB

and a radiation efficiency about 90% over its operational frequency. The whole system

with a small size of 20.2 mm 6.1 mm 2.6 mm

can be easily realized by a standard LTCC process. This antenna-in-package system integrated with a meander line antenna was fabricated and the experimental results agreed with simulations well.

关键词

Keywords

references

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